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  1. Techstar Innovations specialises in Gold Wire Bonder, Die Bonder, Flip chip Bonder, Aluminium Wire Wedge Bonder, Gold Bonding Wire, BGA Solder Sphere Ball, ...

    A specialist in semiconductor Gold Wire Bonder, Die Bonder, Flip Chip Bonder, Gold Bonding Wire, BGA Solder Sphere Ball, Aluminium Wire Wedge Bonder, Auto ...
    wire bonding1
    Die Bonding1
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    flip chip bonder1
    solder ball1
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    solder sphere1
    aluminium wire bonder1
    aluminium wedge bonder0
    aluminium wire wedge bonder0
    bga solder ball0
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    die bondings0
    Flip Chip Bonders0
    Flip Chip Bondings0
    gold wire bonder0
    lead frame inspection0
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    semiconductor wire bonders0
    semiconductor wire bondings0
    ultra fine pitch wire bonders0
    ultra fine pitch wire bonding0
    Wire Bondings0

    www.techstar-i.com - 2009-02-07

  2. F&K Delvotec > Test Equipment

    Develops and Manufactures Bonding Equipment, Die Bonders, Wire Bonders, Test Equipment and Fully Integrated Assembly Lines
    mapping2
    COB1
    semiconductor equipment1
    flip chip1
    wire bonding1
    chip on board1
    eutectic1
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    wire bonder1
    die bonder1
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    wedge bonder1
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    F & K1
    F&K Delvotec1

    www.bondtester.com - 2009-02-08

  3. F&K Delvotec

    Develops and Manufactures Bonding Equipment, Die Bonders, Wire Bonders, Test Equipment and Fully Integrated Assembly Lines
    mapping2
    COB1
    semiconductor equipment1
    flip chip1
    wire bonding1
    chip on board1
    eutectic1
    die bonding1
    wire bonder1
    die bonder1
    wire bond1
    wafer mapping1
    wedge bonder1
    Delvotec1
    die bond1
    flip chip bonding1
    ultrasonic bonding1
    wedge bonding1
    ball bond1
    F & K1
    F&K Delvotec1
    used bonder0

    www.fkdelvotecusa.com - 2009-02-07

  4. Panacol-Elosol: Adhesives, bonding, potting, coating, dispensing, curing and sealing,

    Panacol-Elosol: Metal adhesives, glas bonding, heat sealing equipment, silicones, UV curing, chip bonding and more. Panacol-Elosol: Metal adhesives, glas ...
    coating2
    bonding2
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    curing1
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    silicones1
    UV coating1
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    acrylate1
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    conductive adhesives1
    epoxide1
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    cyanoacrylate adhesives1
    chip bonding1
    glass bonding1
    metal adhesives1
    glass adhesive1
    potting compound1
    flip chip bonding1
    thermally conductive adhesives1
    Glob-Top1
    hot bar soldering1
    SMD adhesive1
    bonding technology0
    dye bonder0
    Panacol-Elosol0

    www.panacol.com - 2009-02-12

  5. ACF Anisotropic Conductive Film

    ACF (or Anisotropic conductive film) is an epoxy system used by electronics industry to make electrical and mechanical connections from drive electronics to ...
    film5
    ACF1
    conductive1
    Anisotropic1
    flip chip bonding1
    ACF film0

    www.acffilm.com - 2009-04-02

  6. Hakuto(Thailand) Ltd. - Leader of Auto-Machine and Best of Components Part - Company Profile

    Hakuto (Thailand) Ltd. - Leader of Auto-Machine and Best of Components Part
    communication4
    wireless4
    contact3
    thailand3
    components3
    wire2
    tube2
    temperature2
    robot2
    chip2
    component2
    semiconductor2
    connector2
    smt2
    temp2
    humidity2
    probe2
    socket1
    handler1
    destop1
    reflow soldering1
    scara robot1
    gantry robot1
    flip chip bonding1
    humidity Equipment1
    seamseal1
    hakuto1
    hakuto thailand0
    micro-joint spot welding0
    pressing robot0
    wire&tube0

    www.hakutothailand.com - 2009-02-13

assembly2 lead free1 wire bond1 die bonder1 die bonding1 semiconductor equipment1 bonding2 bga1 flip chip1 die bond1

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